Stäubli at OFC 2026

Introducing the Mini QD – The smallest quick disconnect for high‑density optical modules

As optical module performance continues to scale, power density and thermal loads are increasing rapidly, pushing traditional air‑cooling approaches to their limits. OSFP optical modules, in particular, now require liquid cooling to sustain higher bandwidth, reliability, and serviceability.

This industry transition has been strongly accelerated by the launch of XPO, which introduces liquid‑cooled architectures for next‑generation optical modules and sets a new benchmark for thermal management in high‑density environments.

At OFC 2026, Stäubli is excited to present the Mini QD, our latest innovation designed specifically for high‑density optical infrastructures. Engineered for switch trays exceeding 35 W, the Mini QD addresses the most demanding constraints where space, reliability, and precision are non‑negotiable and fits to liquid cooled OFSPs.

As optical technologies evolve, thermal management and fluid connectivity play a key role in ensuring performance, uptime, and scalability. The Mini QD enables compact, secure, and serviceable liquid cooling circuits, supporting the next generation of liquid‑cooled optical modules.

Stäubli is joining Ciena for a keynote at OFC

Staubli is proud to join Ciena at OFC 2026 for a keynote exploring one of the most critical challenges in next‑generation optical networks: thermal management at extreme power densities. As optical interconnect speeds accelerate, traditional air‑cooling approaches can no longer keep pace with the rising heat generated by advanced optics and DSPs. In collaboration with Ciena, we will present Designing for Density: Direct‑to‑Plug Liquid Cooling for Next‑Generation Pluggable Optics.

SPEAKERS

Bilal Riaz - Senior Director, Interconnects Product Line Management , Ciena, Canada

Jean Christope Duisit - Global Sales and Marketing Director, IT Cooling, Stäubli , France